JPH0241375U - - Google Patents
Info
- Publication number
- JPH0241375U JPH0241375U JP1988119331U JP11933188U JPH0241375U JP H0241375 U JPH0241375 U JP H0241375U JP 1988119331 U JP1988119331 U JP 1988119331U JP 11933188 U JP11933188 U JP 11933188U JP H0241375 U JPH0241375 U JP H0241375U
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- external connection
- outer enclosure
- nut portion
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119331U JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119331U JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0241375U true JPH0241375U (en]) | 1990-03-22 |
| JPH0628786Y2 JPH0628786Y2 (ja) | 1994-08-03 |
Family
ID=31364469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988119331U Expired - Lifetime JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0628786Y2 (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55135487U (en]) * | 1979-03-15 | 1980-09-26 |
-
1988
- 1988-09-13 JP JP1988119331U patent/JPH0628786Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55135487U (en]) * | 1979-03-15 | 1980-09-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0628786Y2 (ja) | 1994-08-03 |